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Military Products |
| Power GaN Modules |
| Using MMICMAN's proprietary "zero thermal path" packaging technology, significant improvements in GaN device thermal performance can be achieved. DOD components have a critical need for increased sensitivity for next generation systems. GaN devices offer a possible 10 fold improvement in performance, but require significant advancement in thermal management. By using the "zero thermal path" approach the system benefits can be realized. |
| Communication Modules |
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MMICMAN's packaged module technology will be used on a family of packaged amplifier modules with one of our strategic partners. These amplifier modules are expected to provide our customers with a lower cost solution with improved manufacturing yields. |
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Other Products and Subsystems |
| MMICMAN is in the early stages of product development on a few key electronic components for DOD systems. Our early system level performance predictions and material evaluations look very promising. |
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(C) Copyright 2008 MMICMAN LLC. All Rights Reserved.
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